Turn-key advanced electronics assembly and testing.

Definium’s advanced manufacturing facility features a suite of electronics assembly capabilities to suit any job. For complicated prototypes or untested designs, clients are welcome to visit the lab and verify the first boards off the line to ensure everything proceeds smoothly.

Our Contract Manufacturing Capabilities

01

Procurement
We can procure printed circuit boards, stencils, and electronics components from our supplier network, if needed.

02

Surface-Mount Assembly
Our SMT production line can place up to 60,000 components per hour and features dual vapour-phase reflow ovens (one with vacuum).

03

Through-Hole Assembly
We have lead-free inert-atmosphere selective soldering capabilities and a team of manual soldering technicians with years of experience.

04

Validation
Automated Optical Inspection (AOI) and X-ray facilities validate boards to prevent defects. We will also validate boards built by third parties.

05

Final Assembly & Testing
We can perform final automated production programming & testing, assembly, final assembly,  assembled unit testing, and production labelling.

06

Warehousing
We can hold your products and ship them directly to distributors, if we performed all other manufacturing work.

Delivering small- to large-batch production runs in record time
that’s what we do best.

We specialise in offering a quick turn-around time for clients that need their products now. We also offer high-volume manufacturing for clients with predictable schedules.

Need more technical details? Download our capabilities statement:

DOWNLOAD CAPABILITIES STATEMENT

OUR EQUIPMENT

Images from manufacturer and distributor websites.

SUMMARY CAPABILITIES

Procurement

  • 1-16 layer PCB
    • Max 450 x 300 mm
  • Flex PCB
  • Solder Stencils
  • Components
  • Packaging

Surface-Mount

  • Automated in-line screen print
    • Repeatability 0.008 mm
    • Lead-free process
  • Surface-mount Placement
    • Accuracy ±0.005 mm
    • Dual mounters with 15 heads total
    • 60,000 components per hour
    • Matrix tray-changer (20 trays)
    • Tube feeders
    • Component sizes:
      • Min 1.0 x 0.5 mm
      • Max 24 x 72 mm
  • Reflow
    • In-line vapour-phase reflow
    • Batch-mode vacuum vapour-phase reflow

Through-Hole

  • Selective soldering
    • Dual head
    • Lead-free inert-atmosphere
  • Manual soldering
    • Lead or lead-free

Validation

  • Automated Optical Inspection (AOI)
    • Batch-mode inspection post-reflow
  • X-Ray
    • BGA and flex-strip inspection
    • Contract inspection & analysis

Final Assembly & Testing

  • Automated production programming
  • Automated production testing
  • Final product assembly
  • Final assembled-product testing
  • Bulk or individual packaging
  • Labelling

Warehousing

  • Stock hold option
  • Ship to distributor option